Transistor Techniques - Transistor Measurements
Test methods
To simplify measurement use the common (grounded) emitter connection and divide transistors into two groups according to the kind of semiconductor used: germanium and silicon junction transistors. Tests for point-contact transistors are omitted because these units have negligible commercial value. Engineers in industry feel that junction transistors eventually will replace point-contact units in most applications.
Measuring lco and lcbo
![]() |
br>
br>
br>
br>
br>
br>
br>
br>
br>
br>
br>
br>
br>
Fig. 401. Measuring dc leakage current between collector and base. Emitter is open circuited.
Fig. 401 shows Ico, the dc leakage between collector and base when the emitter is open-circuited. lco increases with temperature, and should be smaller than lcbo—the smaller it is, the "cleaner" the transistor. Clean transistors have longer life because they are relatively free of contaminating materials.
Both Ico and Icbo increase with age. The tests in Figs. 401 and 402 are the first step in determining whether a transistor can still be used or if replacement is necessary. If Ico and Icbo are erratic, or larger than specified, the transistor should not be used.
Current gain in common-emitter transistors is described in three ways. By current gain (dc), = Ic/Ib; by incremental current gain (dc), b = lc/lb; and small signal current gain, beta or — dic/ dib. The ratio Ic/Ib is often used to describe current gain (dc) in power transistors. It is substituted for ac measurements when the huge current passed through some high-power units exceeds the rating of available radio components. Incremental current gain b is the ratio of incremental changes in collector and base dc (for constant collector voltage Vc). Small-signal (ac) current gain p is the gain from collector to base with the output short-circuited (for constant Et) . The latter two items describe gain for medium- and low-powered transistors.
Germanium Junction Transistors
Early plastic-encapsuled transistors were unreliable. Moisture and impurities, trapped during the encapsulation process, "poisoned" the germanium heart of the transistor. This slow killing process caused unstable operation and failure. Several important facts were learned during the evaluation of plastic-coated transistors. First, transistors must be assembled under surgically clean conditions. Second, rigorous factory tests were necessary if quality and performance were to be maintained. Third, the units had to be enclosed in hermetically sealed containers. For example, transistors encapsuled in plastic had relatively large Ico and Icbo readings. When the same units were assembled under surgical conditions and mounted in hermetically sealed cases, these current readings dropped appreciably.

br>
Fig. 402. Measuring dc leakage current between collector and emitter. Base is open circuited.
Fig. 403. Circuit tests p-n-p junctions. Scope is in dc position with slow sweep.
Transistor noise.
Let's clarify the confusion that exists about transistor noise. The confusion began only because the point-contact unit appeared on the market before the junction type. Point-contact transistors have poor noise properties—a great disadvantage. Junction transistors have excellent noise properties. Noise in many junction transistors measures only 3 or 4 db above theoretical (Johnson) noise. Compare this with about 8 db of noise from the 1620 vacuum tube— the best tube as far as noise is concerned. But tube noise increases when the electrodes are subjected to vibration or shock. In junction transistors, noise is related to the ratio of the sizes of collector and emitter junctions. Hence, noise for a given transistor is fixed and does not change appreciably with vibration or shock. Nominally, noise in good junction transistors is from about 10 to 20 db.
Fig. 404. Drawing at the top shows transistor static characteristics. The circuit diagram below it illustrates a method of measuring incremental current (dc) gain b.
Duality
The duality concept is useful when comparing transistors and vacuum tubes. Base current bias is the dual of grid voltage bias; collector current the dual of plate voltage and collector voltage replaces plate current. In other words, current and voltage functions are interchanged when comparing static characteristics of transistors and tubes.
Fig. 404 shows part of a set of transistor static characteristics. The diagram shows how to measure incremental dc current gain. Rl adjusts base bias current from about 1 to 130 amp. With Ec at —6 volts, adjust Rl so that Ic is about 0.3 ma. Note the values of Ic and Ib. Then change Rl slightly and note the new readings in Ic and Ib. Differences in readings are the incremental changes Alc and Ib Values of b vary widely for various transistors of a given type. For this test, practical working limits for b are from about 18 to 140. If b is less than 18, insufficient gain will be obtained. If it is greater than 140, the transistor probably is unstable.
The small-signal current gain beta in low-powered transistors is the dual of in a triode vacuum tube. A circuit for the measurement of is shown in Fig. 405. The choke should be a UTC HQB-6 or equivalent, and the capacitors pyranol or equivalent nonpolarized. The beta factor is defined as collector-to-base current gain with the output short-circuited. Adjust Rl so that Ic is 1 ma. Set El to 1 volt at 1 kc. Resistor R2 essentially shorts out the output.
Fig. 406. Measuring output impedance. Impedance values for transistors cover a wide range with an average of about 40,000 ohms.
Power Transistors
Germanium power transistors have a different design than the small-signal units just described. Essentially, power units have a larger collector junction area. And since large amounts of heat are liberated in this area (about 1 /50 square inch in the Minneapolis-Honeywell type 2N57 p-n-p power transistor), adequate cooling must be provided. Otherwise, the junction would overheat and be destroyed. The 2N57 is cooled by mounting the collector junction on a copper stud. Then the stud (Fig. 407) is attached to a metal chassis (heat sink) to permit rapid dissipation of heat. The photograph, Fig. 408 shows a 2N57 attached to a chassis. Because of this design, the 2N57 is rated at a dc collector dissipation of 20 watts, of which 6 watts theoretically, can be converted to useful ac output power.
Measurements of Ico and I,.b„ for power transistors are made with the circuits of Figs. 401 and 402. But a milliammeter is substituted for the microammeter and a larger battery is used. The manufacturer specifies that Ic„ for the 2N57 shall be less than 5 ma with —70 volts between collector and base at room temperature, and Icb0 shall be less than 27 ma with —70 volts on the collector.
Fig. 408. A 2N57 attached to a chassis. The paper clip furnishes an indication of comparative sizes. The useful ac output power of this transistor is approximately six watts. The mounting technique is an important factor in heat dissipation.
Silicon Junction Transistors
Available silicon junction transistors are of the n-p-n grown junction type. Their principal value is that they can be used at higher temperatures—around 150° C for example. This is because silicon has a higher energy gap (1.1 electron volts) than germanium (0.72 electron volt) . So since the energy gap between filled and conduction bands is large, the intrinsic contribution to conductivity is reduced greatly.
As far as test methods are concerned, we are interested in the same parameters mentioned earlier. The same test circuits can be used (except that battery and meter connections must be reversed for n-p-n transistors).
At room temperatures, Ico and Icbo for low- and medium-powered units should be less than 2 amp with 22.5 volts on the collector.
When a silicon unit is operated at 100° C, Ic„ should be less than 12 Liamp. Noise in silicon units is slightly higher than in germanium units, but is objectionable only in units with high beta factors. Since p adequately describes the performance of available silicon units, and since leakage currents are so small, the dc and incremental dc current gain tests can be postponed until high-power (10 watts or greater) units are available.

br>
Fig. 409. Measuring current gain (dc). The current gain (beta) should be between 10 and 20.
The spread in for both low- and medium-powered silicon units is from about 4 to more than 75. There is no official recommendation regarding practical working limits. Some designers and service technicians use an unofficial rule of thumb from about 18 to 36 (as measured with 6 volts on the collector).

Output impedances (Fig. 406) of between 15,000 and 80,000 ohms (common-emitter circuit) give satisfactory results. Rout varies widely from unit to unit.
Heat Sink
Dc voltage requirements
An attractive feature of the power transistor is its low dc voltage requirement. However, it is as true of power transistors as of other matters that one does not receive something for nothing. High current is the price paid for this low voltage. The high direct currents of the power transistor impose rather severe requirements on the design of the coupling transformers and on that of the power supply. While on this subject, it should be mentioned that standard, catalogued transformers are unsatisfactory at the low-impedance and high-current levels met in the power transistor. At present, both input and output transformers must either be obtained on special order or built by the user.
The diagram in Fig. 411 shows a typical class-B power-transistor output amplifier stage. Resistor Rl and the battery voltage are selected for a total no-signal collector current of 1 ma. Heavily bypassed emitter stabilization resistors are required if collector current shows a tendency toward "runaway." A typical heat sink would consist of a 25-square-inch chassis, 1/16 inch thick. The maximum-signal current of this stage is 550 ma and maximum power output is 5 watts.
- planright's blog
- 1714 reads




Post new comment