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It is important that power semiconductors are correctly mounted if full functionality is to be achieved. Incorrect mounting may lead to both thermal and mechanical problems. The aim of this Application Note is to describe good practise in the mounting of power semiconductors.

This application note describes a mounting method for a 90–Watt power device. This mounting methodology is recommended for any ceramic/metal flange device with similar materials and construction (copper tungsten flange with ceramic insulator and Alloy–42 leads) and up to 90 Watts output power. This mounting method involves bolt–down of the CuW flange to a heatsink with the leads soldered to a printed circuit board (PCB).

The following document describes a solder mounting method for a 90–Watt power device. This mounting methodology is recommended for any ceramic/metal flange device with similar materials and construction (copper tungsten flange with ceramic insulator and Alloy–42 leads) and up to 90 Watts of RF output power. This mounting method involves soldering the CuW flange to a heatsink with the leads soldered to a printed circuit board (PCB).

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