<?xml version="1.0" encoding="utf-8"?>
<rss version="2.0" xml:base="http://dev.emcelettronica.com" xmlns:dc="http://purl.org/dc/elements/1.1/">
<channel>
 <title>TO-220</title>
 <link>http://dev.emcelettronica.com/taxonomy/term/435</link>
 <description>The taxonomy view with a depth of 0.</description>
 <language>en</language>
<item>
 <title>MOUNTING AND HANDLING GUIDELINES FOR TO-220 PACKAGES</title>
 <link>http://dev.emcelettronica.com/pcb/application_to-220</link>
 <description>&lt;p&gt;&lt;a href=&quot;http://www.aosmd.com/pdfs/appNotes/AN101_TO220_Guidelines.pdf&quot; title=&quot;TO-220&quot; target=&quot;_blank&quot;&gt;&lt;img src=&quot;/files/u4/AN101_TO220_Guidelines.jpg&quot; alt=&quot;TO-220&quot; align=&quot;left&quot; hspace=&quot;5&quot;/&gt;&lt;/a&gt; The TO-220 is a popular package for power devices because of its versatility and ability to dissipate moderate amounts of heat. This application note describes the basic guidelines for handling power MOSFETs in TO-220 packages. Please note that only mechanical and soldering guidelines are covered here. Additional precautions are required for isolating high voltage rated devices to meet safety regulations.&lt;br /&gt;
&lt;/ br&gt;&lt;br /&gt;
&lt;/ br&gt;&lt;br /&gt;
&lt;/ br&gt;&lt;br /&gt;
&lt;/ br&gt;&lt;br /&gt;
&lt;/ br&gt;&lt;br /&gt;
&lt;/ br&gt;&lt;br /&gt;
&lt;/ br&gt;&lt;/p&gt;
&lt;p&gt;&lt;a href=&quot;http://dev.emcelettronica.com/pcb/application_to-220&quot;&gt;read more&lt;/a&gt;&lt;/p&gt;</description>
 <comments>http://dev.emcelettronica.com/pcb/application_to-220#comments</comments>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/155">MOSFETs</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/435">TO-220</category>
 <pubDate>Thu, 24 Jan 2008 16:48:45 +0100</pubDate>
 <dc:creator>Chris</dc:creator>
 <guid isPermaLink="false">51602 at http://dev.emcelettronica.com</guid>
</item>
</channel>
</rss>
