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 <title>Mechanics</title>
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 <title>Mechanics and Electronics as Instrument for Minimized Drive Applications</title>
 <link>http://dev.emcelettronica.com/pcb/application_mechanins_and_electronics</link>
 <description>&lt;p&gt;&lt;a href=&quot;http://em.tycoelectronics.com/news/PCIM_presentation.pdf&quot; title=&quot;Mechanics and Electronics&quot; target=&quot;_blank&quot;&gt;&lt;img src=&quot;/files/u4/PCIM_presentation.jpg&quot; alt=&quot;Mechanics and Electronics&quot; align=&quot;left&quot; hspace=&quot;5&quot;/&gt;&lt;/a&gt; The goal of this report is to show the electrical and mechanical requirements for power modules, such as compact outline, low inductance, thermal connection to heat sink and stress relief of the electrical interconnection. The special focus is the mechanical interaction between PCB, module and heat sink.&lt;br /&gt;
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&lt;p&gt;&lt;a href=&quot;http://dev.emcelettronica.com/pcb/application_mechanins_and_electronics&quot;&gt;read more&lt;/a&gt;&lt;/p&gt;</description>
 <comments>http://dev.emcelettronica.com/pcb/application_mechanins_and_electronics#comments</comments>
 <category domain="http://dev.emcelettronica.com/tutorial">RESOURCES</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/45">Pcb</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/248">electronics</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1076">heat sink</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1075">Mechanics</category>
 <pubDate>Thu, 24 Jan 2008 22:24:42 +0100</pubDate>
 <dc:creator>Chris</dc:creator>
 <guid isPermaLink="false">51616 at http://dev.emcelettronica.com</guid>
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