http://dev.emcelettronica.com/taxonomy/term/1073 The taxonomy view with a depth of 0. en http://dev.emcelettronica.com/pcb/application_assembly_instructions <p><a href="http://www.actel.com/documents/CQFP_Assem_AN.pdf" title="Assembly Instructions" target="_blank"><img src="/files/u4/CQFP_Assem_AN.jpg" alt="Assembly Instructions" align="left" hspace="5"/></a> To minimize board-level vibration failure, it is important to attach a ceramic quad flat pack (CQFP) to system boards in the correct way. Following the correct procedures will not completely eliminate vibration failure, but will help prevent initial mistakes, which can minimize vibration failure. Because each customer’s application is different, Actel recommends that the user evaluate his/her application requirements and select the right material and procedures when attaching CQFP packages on system boards.<br /> </ br><br /> </ br><br /> </ br><br /> </ br><br /> </ br><br /> </ br><br /> </ br></p> <p><a href="http://dev.emcelettronica.com/pcb/application_assembly_instructions">read more</a></p> http://dev.emcelettronica.com/pcb/application_assembly_instructions#comments RESOURCES Pcb CQFP SMT Thu, 24 Jan 2008 22:15:47 +0100 Chris 51615 at http://dev.emcelettronica.com