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 <title>Heatsink</title>
 <link>http://dev.emcelettronica.com/taxonomy/term/1065</link>
 <description>The taxonomy view with a depth of 0.</description>
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 <title>LNBK20D2 LNB SUPPLY AND CONTROL VOLTAGE REGULATOR (PARALLEL INTERFACE)</title>
 <link>http://dev.emcelettronica.com/pcb/application_lnbk20d2_lnb</link>
 <description>&lt;p&gt;&lt;a href=&quot;http://www.stmicroelectronics.com/stonline/books/pdf/docs/7238.pdf&quot; title=&quot;LNBK20D2&quot; target=&quot;_blank&quot;&gt;&lt;img src=&quot;/files/u4/9444.jpg&quot; alt=&quot;LNBK20D2&quot; align=&quot;left&quot; hspace=&quot;5&quot;/&gt;&lt;/a&gt; Intended for analog and digital satellite receivers, the LNBK20D2 is a monolithic linear voltage regulator, assembled in SO-20, specifically designed to provide the powering voltages and the interfacing signals to the LNB downconverter situated in the antenna via the coaxial cable. It has the same functionality of the LNBP1X and LNBP20 series, at a reduced output current capability.&lt;br /&gt;
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&lt;p&gt;&lt;a href=&quot;http://dev.emcelettronica.com/pcb/application_lnbk20d2_lnb&quot;&gt;read more&lt;/a&gt;&lt;/p&gt;</description>
 <comments>http://dev.emcelettronica.com/pcb/application_lnbk20d2_lnb#comments</comments>
 <category domain="http://dev.emcelettronica.com/tutorial">RESOURCES</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/45">Pcb</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1065">Heatsink</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1080">LNB</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/26104">LNBK20D2</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/722">Voltage Regulator</category>
 <pubDate>Fri, 25 Jan 2008 07:53:18 +0100</pubDate>
 <dc:creator>Chris</dc:creator>
 <guid isPermaLink="false">51618 at http://dev.emcelettronica.com</guid>
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 <title>Guidelines on leadforming, trimming lead lengh and heatsink mounting</title>
 <link>http://dev.emcelettronica.com/pcb/application_leadforming_trimming_lead_lengh_and_heatsink_mounting</link>
 <description>&lt;p&gt;&lt;a href=&quot;http://www.fairchildsemi.com/an/AN/AN-6060.pdf&quot; title=&quot;Leadforming&quot; target=&quot;_blank&quot;&gt;&lt;img src=&quot;/files/u4/AN-6060.jpg&quot; alt=&quot;Leadforming&quot; align=&quot;left&quot; hspace=&quot;5&quot;/&gt;&lt;/a&gt; The ever increasing demand for smaller consumer products often results in semiconductor designs manipulating package configurations to fit intended designs. More specifically, designs often require customs leadforming and module assembly practices for packages like the TO-262, TO-220,  TO-247.&lt;br /&gt;
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&lt;p&gt;&lt;a href=&quot;http://dev.emcelettronica.com/pcb/application_leadforming_trimming_lead_lengh_and_heatsink_mounting&quot;&gt;read more&lt;/a&gt;&lt;/p&gt;</description>
 <comments>http://dev.emcelettronica.com/pcb/application_leadforming_trimming_lead_lengh_and_heatsink_mounting#comments</comments>
 <category domain="http://dev.emcelettronica.com/tutorial">RESOURCES</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/45">Pcb</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1065">Heatsink</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1066">leadforming</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1068">mouting</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1067">trimming</category>
 <pubDate>Thu, 24 Jan 2008 21:10:08 +0100</pubDate>
 <dc:creator>Chris</dc:creator>
 <guid isPermaLink="false">51611 at http://dev.emcelettronica.com</guid>
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 <title>Heatsink Small Outline Package (HSOP)</title>
 <link>http://dev.emcelettronica.com/pcb/application_hsop</link>
 <description>&lt;p&gt;&lt;a href=&quot;http://www.freescale.com/files/analog/doc/app_note/AN2388.pdf&quot; title=&quot;HSOP&quot; target=&quot;_blank&quot;&gt;&lt;img src=&quot;/files/u4/AN2388.jpg&quot; alt=&quot;HSOP&quot; align=&quot;left&quot; hspace=&quot;5&quot;/&gt;&lt;/a&gt; This document is intended to provide information on Heatsink Small Outline Package (HSOP) and its process. The package related information includes: Component and board level reliability, electrical parasitic and thermal resistance data.&lt;br /&gt;
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&lt;p&gt;&lt;a href=&quot;http://dev.emcelettronica.com/pcb/application_hsop&quot;&gt;read more&lt;/a&gt;&lt;/p&gt;</description>
 <comments>http://dev.emcelettronica.com/pcb/application_hsop#comments</comments>
 <category domain="http://dev.emcelettronica.com/tutorial">RESOURCES</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/45">Pcb</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1065">Heatsink</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1064">HSOP</category>
 <pubDate>Thu, 24 Jan 2008 19:00:53 +0100</pubDate>
 <dc:creator>Chris</dc:creator>
 <guid isPermaLink="false">51608 at http://dev.emcelettronica.com</guid>
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