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 <title>HSOP</title>
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 <title>Heatsink Small Outline Package (HSOP)</title>
 <link>http://dev.emcelettronica.com/pcb/application_hsop</link>
 <description>&lt;p&gt;&lt;a href=&quot;http://www.freescale.com/files/analog/doc/app_note/AN2388.pdf&quot; title=&quot;HSOP&quot; target=&quot;_blank&quot;&gt;&lt;img src=&quot;/files/u4/AN2388.jpg&quot; alt=&quot;HSOP&quot; align=&quot;left&quot; hspace=&quot;5&quot;/&gt;&lt;/a&gt; This document is intended to provide information on Heatsink Small Outline Package (HSOP) and its process. The package related information includes: Component and board level reliability, electrical parasitic and thermal resistance data.&lt;br /&gt;
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&lt;p&gt;&lt;a href=&quot;http://dev.emcelettronica.com/pcb/application_hsop&quot;&gt;read more&lt;/a&gt;&lt;/p&gt;</description>
 <comments>http://dev.emcelettronica.com/pcb/application_hsop#comments</comments>
 <category domain="http://dev.emcelettronica.com/tutorial">RISORSE</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/45">Pcb</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1065">Heatsink</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1064">HSOP</category>
 <pubDate>Thu, 24 Jan 2008 19:00:53 +0100</pubDate>
 <dc:creator>Chris</dc:creator>
 <guid isPermaLink="false">51608 at http://dev.emcelettronica.com</guid>
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