Thermal

Mounting method with mechanical fasteners for the MRF19090 and for similar packages

Chris — Thu, 24 Jan 2008 18:55:11 +0100

This application note describes a mounting method for a 90–Watt power device. This mounting methodology is recommended for any ceramic/metal flange device with similar materials and construction (copper tungsten flange with ceramic insulator and Alloy–42 leads) and up to 90 Watts output power. This mounting method involves bolt–down of the CuW flange to a heatsink with the leads soldered to a printed circuit board (PCB).

Cree® XLamp® LED Thermal Management

Chris — Thu, 24 Jan 2008 18:46:40 +0100

XLamp LEDs lead the solid-state lighting industry in brightness while providing a reflow-solderable design that is optimized for ease of use and thermal management. Lighting applications featuring XLamp LEDs maximize light output and increase design flexibility, while minimizing environmental impact. They are used in a broad range of both specialized and general lighting applications. When designing lighting systems using LEDs, one of the most critical design parameters should be the system’s ability to draw heat away from the LED junction.

Thermal Considerations PPC970FX

Chris — Thu, 24 Jan 2008 16:34:06 +0100

The 64-bit IBM PowerPC 970FX (PPC970FX) enters a new era of processing power and thermal dissipation over earlier PowerPC products. The processor can operate at multiple GHz clock speeds and can dissipate relatively high levels of power through a very small processor die. The high power dissipation levels of the high clock rate parts and small exposed area of the PPC970FX die dictate the need to carefully select the heatsink, thermal interface materials, and mounting methods for each intended application.