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 <title>PPC970FX</title>
 <link>http://dev.emcelettronica.com/taxonomy/term/1055</link>
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 <title>Thermal Considerations PPC970FX</title>
 <link>http://dev.emcelettronica.com/pcb/application_thermal_considerations_PPC970FX</link>
 <description>&lt;p&gt;&lt;a href=&quot;http://www-01.ibm.com/chips/techlib/techlib.nsf/techdocs/9DBF300EB19A60D287256E4B005E43EC/$file/970fx_thermal_an_7_20_05.pdf&quot; title=&quot;PCB Layout Guideline&quot; target=&quot;_blank&quot;&gt;&lt;img src=&quot;/files/u4/970fx_thermal.jpg&quot; alt=&quot;PCB Layout Guideline&quot; align=&quot;left&quot; hspace=&quot;5&quot;/&gt;&lt;/a&gt; The 64-bit IBM PowerPC 970FX (PPC970FX) enters a new era of processing power and thermal dissipation over earlier PowerPC products. The processor can operate at multiple GHz clock speeds and can dissipate relatively high levels of power through a very small processor die. The high power dissipation levels of the high clock rate parts and small exposed area of the PPC970FX die dictate the need to carefully select the heatsink, thermal interface materials, and mounting methods for each intended application.&lt;br /&gt;
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&lt;p&gt;&lt;a href=&quot;http://dev.emcelettronica.com/pcb/application_thermal_considerations_PPC970FX&quot;&gt;read more&lt;/a&gt;&lt;/p&gt;</description>
 <comments>http://dev.emcelettronica.com/pcb/application_thermal_considerations_PPC970FX#comments</comments>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1055">PPC970FX</category>
 <category domain="http://dev.emcelettronica.com/taxonomy/term/1056">Thermal</category>
 <pubDate>Thu, 24 Jan 2008 16:34:06 +0100</pubDate>
 <dc:creator>Chris</dc:creator>
 <guid isPermaLink="false">51600 at http://dev.emcelettronica.com</guid>
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