Recently, the MAX555 has changed its package type from a 68-pin PLCC (Plastic Lead Chip Carrier) to a 64-pin TQFP (Thin Quad Flat Pack) package. To accommodate the package change in existing designs, this application note was created to provide helpful PCB layout guidelines for designers who have been developing systems based on the PLCC version of the MAX555 and are now required to make a quick and effortless transition from PLCC to TQFP.