Your Electronics Open Source

This application note provides guidelines for printed circuit board (PCB) design using the WirelessUSB™ LS 2.4-GHz DSSS Radio SoC IC and its application as an integrated wireless communication solution. A properly designed PCB facilitates the evaluation, characterization, and production test correlation of the WirelessUSB LS radio. These recommendations have been tested and proven by Cypress Semiconductor to ensure optimal radio performance when combining RF analog circuitry with other low-frequency analog and digital board components.

This application note describes guidelines for a Printed Circuit Board (PCB) footprint for the QFN32 package used for the MC1319x. Included are layouts of the component copper layer, solder mask, and solder paste stencil. These recommendations are guidelines only and may need to be modified depending on the assembly house used and the other components on the board.

As both device pin density and system frequency increase, printed circuit board (PCB) layout becomes more complex. A successful high-speed board must effectively integrate the devices and other elements while avoiding signal transmission problems associated with high-speed I/O standards. Because Altera® devices feature fast I/O pins, a wide variety of high-speed features, and edge rates less than a hundred picoseconds, it is imperative that an effective design successfully.

The differential trace impedance of HDMI is specified at 100Ω±15% in Test ID 8-8 in HDMI Compliance Test Specification Rev.1.2a and 1.3a. Rev. 1.3a has a more relaxed specification which allows an occurrence of a single excursion out to a max/min of 100Ω±25% and of a duration less than 250ps. General PCB knowledge (PCB Prepreg Selection, Critical Signal Trace Length and Microstrip Stub Effect) and impedance control on 4-layer PCB of 1080+2116 Prepreg will be discussed in this layout guideline.

The LAN8700/LAN8700I and LAN8187/LAN8187I are higly-integrated devices designed for 10*100Mbps Ethernet systems. they are based on IEEE 10BAZE-T and 100BAZE-TX standards. The IEEE 802.3-2005 standard for 100BAZE-TX defines networking over two pairs of Category 5 unshielded twisted pair table or Type 1 shielded twisted pair table.

The Universal Serial Bus (USB) is capable of operating at 480 Mbps. Excellent signal integrity is required to operate reliably at high-speed data rates.The PCB layout is a critical component in maintaining signal integrity. This document provides recommendations regarding the PCB layout. This application note is written for a reader that is familiar with hardware design, USB protocols and the USB 2.0 specification. The goal of the application note is to provide information on sensitive areas of the PCB layout.

Recently, the MAX555 has changed its package type from a 68-pin PLCC (Plastic Lead Chip Carrier) to a 64-pin TQFP (Thin Quad Flat Pack) package. To accommodate the package change in existing designs, this application note was created to provide helpful PCB layout guidelines for designers who have been developing systems based on the PLCC version of the MAX555 and are now required to make a quick and effortless transition from PLCC to TQFP.

This document provides a practical guideline for incorporating the Philips Peripheral Component Interconnect (PCI) Express Physical (PHY) IC layout into a Printed Circuit Board (PCB) design. This document is composed of two main sections:
Section 2 provides guidelines for PCI Express lane connection for the PCB traces, vias and AC coupling capacitors, as well as add-in card edge finger considerations.
Section 3 describes the layout and termination of PXPIPE, which is Philips’ proposed interface between the PHY and the Media Access Control (MAC).

One problem with writing an Application Note on PCB layout is that the people who read it are usually not the ones who are going to use it. Even if the designer has struggled through electromagnetic fields, EMC, EMI, board parasitics, transmission line effects, grounding, etc., he will in all probability then go on with his primary design task, leaving the layout to the CAD/layout person. Unfortunately, especially when it comes to switching regulators, it is not enough to be concerned with just basic routing/connectivity and mechanical issues.

The PI6C110/110E is an integrated clock generator and SDRAM buffer, providing all the timing signals for the Intel Whitney 810/ 810E chipset. This brief provides the recommended connections for the PI6C110/110E clock generator to control EMI and to ensure proper device performance. Many of the following techniques can be applied to a variety of high-speed clock designs.