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This document provides guidelines for component placement and PCB routing of the USB 2.0 portion of the QuickLogic ArcticLink Solutions Platform. Follow the suggested guidelines to minimize signal integrity issues. Figure 1 shows the QuickLogic ArcticLink Solutions Platform including the FPGA and ASSP parts. In addition to other components, the ASSP part contains a Hi-Speed USB 2.0 On-The-Go (OTG) subsystem that is capable of transferring data at speeds of 480 MHz.
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