Solder mounting method for the MRF19090S and similar packages

Thu, 01/24/2008 - 17:57 — Chris

The following document describes a solder mounting method for a 90–Watt power device. This mounting methodology is recommended for any ceramic/metal flange device with similar materials and construction (copper tungsten flange with ceramic insulator and Alloy–42 leads) and up to 90 Watts of RF output power. This mounting method involves soldering the CuW flange to a heatsink with the leads soldered to a printed circuit board (PCB).
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