PCB DESIGN
Printed circuit board (PCB) is a component made of one or more layers of insulating material with electrical conductors. The insulator is made of various materials that are based on fiberglass, ceramics, or plastic. During manufacturing the portions of conductors that are not needed are etched off, leaving printed circuits that connect electronic components.






PCB Layout
High frequency pcb design requires careful grounding. Use ground plane for control circuit. Try to make most of signal ground connections through vias to this ground plane rather then through PC traces. For each power supply stage, keep power ground and control ground separately. Tight them together [If they are electrically connected] in one point near DC output return of the given stage.






PCB Layout Guidelines and Tips for a Successful Layout
Here are a few suggestions and guidelines we use to insure quality, quick turnaround, and ultimately a superior product. P.D.C.'s main strength lies in its technical expertise in all phases of circuit board production from concept design to fabrication to finished product assembly. P.D.C. has the unique advantage of understanding every phase of a given project and how each may affect the other.






System operation frequencies are increasing, PCB layout is becoming increasingly complex. A successful high-speed PCB must effectively integrate the IC’s and other components into a single design. MCS7840 has USB2.0 interface and utilize fast I/O pins. As Fast edge rates can contribute to noise generation, signal reflection, cross-talk and ground bounce; designers must be careful to handle these issues during PCB layout. This document provides guidelines for designing MCS7840 PCB’s.
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Moschip Application Note download PDF

PI6C110/PI6C110E Layout Guidelines
The PI6C110/110E is an integrated clock generator and SDRAM buffer, providing all the timing signals for the Intel Whitney 810/ 810E chipset. This brief provides the recommended connections for the PI6C110/110E clock generator to control EMI and to ensure
proper device performance. Many of the following techniques can be applied to a variety of high-speed clock designs.
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Pericom Application Note download PDF

SIMPLE SWITCHER® PCB Layout Guidelines
One problem with writing an Application Note on PCB layout is that the people who read it are usually not the ones who are going to use it. Even if the designer has struggled through electromagnetic fields, EMC, EMI, board parasitics, transmission line effects, grounding, etc., he will in all probability then go on with his primary design task, leaving the layout to the CAD/layout person. Unfortunately, especially when it comes to switching regulators, it is not enough to be concerned with just basic routing/connectivity and mechanical issues.
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National Application Note download PDF

The MAX555 PLCC-to-TQFP Printed Circuit Board (PCB) Layout Guidelines
Recently, the MAX555 has changed its package type from a 68-pin PLCC (Plastic Lead Chip Carrier) to a 64-pin TQFP (Thin Quad Flat Pack) package. To accommodate the package change in existing designs, this application note was created to provide helpful PCB layout guidelines for designers who have been developing systems based on the PLCC version of the MAX555 and are now required to make a quick and effortless transition from PLCC to TQFP.
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Maxim Application Note download PDF

Solder mounting method for the MRF19090S and similar packages
The following document describes a solder mounting method for a 90–Watt power device. This mounting methodology is recommended for any ceramic/metal flange device with similar materials and construction (copper tungsten flange with ceramic insulator and Alloy–42 leads) and up to 90 Watts of RF output power. This mounting method involves soldering the CuW flange to a heatsink with the leads soldered to a printed circuit board (PCB).
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Freescale Application Note download PDF

Section II. PCB Layout Guidelines
This section provides information for board layout designers to successfully layout their boards for MAX® II devices. It contains the required printed circuit board (PCB) layout guidelines, device pin tables, and package specifications. This section includes the following chapters: Chapter 7. Package Information and Chapter 8. Using MAX II Devices in Multi-Voltage Systems. Refer to each chapter for its own specific revision history. For information about when each chapter was updated, refer to the Chapter Revision Dates section, which appears in the complete handbook.
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Altera Application Note download PDF

PI3HDMIxxx 4-Layer PCB Layout Guideline for HDMI Products
The differential trace impedance of HDMI is specified at 100Ω±15% in Test ID 8-8 in HDMI Compliance Test Specification Rev.1.2a and 1.3a. Rev. 1.3a has a more relaxed specification which allows an occurrence of a single excursion out to a max/min of 100Ω±25% and of a duration less than 250ps. General PCB knowledge (PCB Prepreg Selection, Critical Signal Trace Length and Microstrip Stub Effect) and impedance control on 4-layer PCB of 1080+2116 Prepreg will be discussed in this layout guideline.
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Pericom Application Note download PDF