As both device pin density and system frequency increase, printed circuit board (PCB) layout becomes more complex. A successful high-speed board must effectively integrate the devices and other elements while avoiding signal transmission problems associated with high-speed I/O standards. Because Altera® devices feature fast I/O pins, a wide variety of high-speed features, and edge rates less than a hundred picoseconds, it is imperative that an effective design successfully.







The LAN8700/LAN8700I and LAN8187/LAN8187I are higly-integrated devices designed for 10*100Mbps Ethernet systems. They are based on IEEE 10BAZE-T and 100BAZE-TX standards. The IEEE 802.3-2005 standard for 100BAZE-TX defines networking over two pairs of Category 5 unshielded twisted pair table or Type 1 shielded twisted pair table.







Thermal management design of LEDs
Today there are various applications in every field. In response to this increase in various applications, Nichia Corporation is producing mini power LEDs and high power LEDs that ca be driven at high currents. Mini power LED are suitable for less brightness or small output applications, such as back lighting systems, indicators and so on.







Mounting Considerations for International Rectifier’s Power Semiconductor Packages
Hittite’s new surface mount HMC121C8 Voltage Variable Attenuator (VVA) and HMC 220 mixer in ceramic and plastic packages are being used in higher frequency applications for both military and commercial markets. Along with other products from Hittite, these low cost packages can range in frequency from DC to 15 GHz for use in microwave radio systems, VSAT, WLAN and cellular communication applications. In order to achieve the benefi ts offered by these devices, particular attention must be paid to the layout of the circuit board that the device is placed on.







Heatsink Small Outline Package (HSOP)
This document is intended to provide information on Heatsink Small Outline Package (HSOP) and it's process. The package related information includes: Component and board level reliability, electrical parasitic and thermal resistance data.







Guidelines on leadforming, trimming lead lengh and heatsink mounting
The ever increasing demand for smaller consumer products often results in semiconductor designs manipulating package configurations to fit intended designs. More specifically, designs often require customs leadforming and module assembly practices for packages like the TO-262, TO-220, TO-247.







Evaluation kit for MP230FC/MP240FC pin out
This easy-to-use kit provides a platform for the evaluation of linear power amplifiers circuits using the MP230FC/MP240FC pin out. With ample bread boarding areas it is flexible enough to analyze a multitude of standard or proprietary circuit configurations. Critical connections for power supply bypassing are pre-wired. Components not usually readily available in engineering labs are provided. External connection to the evaluation kit can be made via the terminal block and the banana jacks at the edges of the circuit board.







EN5312Q/EP5352Q/EP5362Q/EP5382Q DC-DC Converters
The Enpirion EN5312Q, EP5352Q, EP5362Q and EP5382Q DC-DC converters are packaged in 5x4x1.1mm 20-pin QFN packages that have the same thermal characteristics. The QFN packages are constructed with copper lead frames that have exposed thermal pads. The recommended maximum junction temperature for continuous operation is 125°C. Continuous operation above 125°C will reduce long-term reliability.







Designers Maximize TVS Diode Performance
A transient voltage suppressor (TVS) diode is an effective, low-cost option to protect sensitive electronic components from electrostatic discharge (ESD) and electromagnetic interference (EMI) surge pulses. However, to maximize the surge immunity provided by a TVS diode, designers should follow certain printed circuit board (PCB) layout guidelines. Layout examples help illustrate the tradeoffs between the different circuit confi gurations available with TVS diodes.







DE-Series MOSFET, DEIC420 And SOP-28 IC
The DE-Series MOSFETs or ICs may be mounted in three different configurations, depending upon the application and power dissipation required. This document refers to MOSFET mounting, however these mounting instructions also apply to the DEIC420 gate driver IC. The package dimensions of the DEIC420 are identical to those of the DE-275 Series MOSFETs. Additionally, mounting topologies for the IXDD415 and IXLD02 ICs are discussed.







Cree® XLamp® LED Thermal Management
XLamp LEDs lead the solid-state lighting industry in brightness while providing a reflow-solderable design that is optimized for ease of use and thermal management. Lighting applications featuring XLamp LEDs maximize light output and increase design flexibility, while minimizing environmental impact. They are used in a broad range of both specialized and general lighting applications. When designing lighting systems using LEDs, one of the most critical design parameters should be the system’s ability to draw heat away from the LED junction.







Board Design Guidelines for LVDS Systems
Low-voltage differential signaling (LVDS) is a high speed, low voltage, low power, and low noise general-purpose I/O interface standard. Its low-voltage swing and differential current mode outputs significantly reduce electromagnetic interference (EMI). These outputs have fast edge rates that cause signal paths to act as transmission lines. Therefore, ultra-high-speed board design and differential signal theory knowledge is especially useful for designing a board containing Altera devices that integrate LVDS.







Assembly Instructions for CQFP Packages SMT on PCB
To minimize board-level vibration failure, it is important to attach a ceramic quad flat pack (CQFP) to system boards in the correct way. Following the correct procedures will not completely eliminate vibration failure, but will help prevent initial mistakes, which can minimize vibration failure. Because each customer’s application is different, Actel recommends that the user evaluate his/her application requirements and select the right material and procedures when attaching CQFP packages on system boards.







ND3260 Print Circuit Board Design Guidelines
This document provides guideline for the design of ND3260 print circuit boards. The material includes demo board placement, schematics, layout guidelines, general USB 2.0 considerations, BOM, Flash ROM supporting list. For more detail please refer to ND3260 the Multi-Format Flash Memory Card Reader with USB2.0 HS Interface Specification.







AN6064 FSHDMI311 PCB Layout Guidelines DVI/HDMI Repetear
This application note provides guidelines for successful PCB layout techniques for Fairchild's FSHDMI311 DVI/HDMI Repeater. For additional information rewiev the FSHDMI311 datasheet. The FSHDMI311 features one HDMI input port and one HDMI output port. It re-transmits the high-speed TDMS signals and the low speed DDC signals. This guide discusses the PCB placement and routing off all critical components in order of important. In addition to the FSHDMI311 -specific recommendations listed here, common high-speed layout techniques shoul be also used.







Using a circuit-driven approach to teach PCB layout techniques for switching power supply circuits
Power supply circuits are critical components in all electrical systems. They not only supply power but must also do so without degrading system performance with noise and/or sagging supply voltages, which is why the layout of the PCB is extremely important. Key power supply specifications like output voltage accuracy and power efficiency worsen when the layout of PCB is less then optimal, since the effects of parasitic PCB resistances and inductances are considerably high for high-current, fast-switching traces.







PCB DESIGN GUIDELINES. Guidelines for the design and layout of high-speed digital logic PCBs
• Give a lot of consideration to component placement and orientation.
• Avoid overlapping clock harmonics. Make a harmonic table for each clock.
• Clock signal loop area must be kept as small as possible. Get paranoid about clocks!
• Use multilayer boards with power & ground planes whenever possible.
• All high frequency signal traces must be on layers adjacent to a plane.
• Keep signal layers as close to the adjacent plane layer as possible (< 10 mils).







PCB layout
Printed Circuit Boards are primarily an insulating material used as base, into which conductive strips are printed. The base material is generally fiberglass, and the conductive connections are generally copper and are made through an etching process. The main PCB board is called the motherboard, the smaller attachment PCB boards are called daughter boards or daughter cards. PCB board design defines the electrical pathways between components.







PCI PCB Design Layout Guidelines
Careful attention must always be exercised when beginning the design and layout phase of any new printed circuit board. It is only through careful planning and the usage of good electrical design practices that long term product reliability maybe achieved. Careful attention to layout issues of EMI, cross-talk and decoupling will avoid engineering prototype development problems and feature production failures due to an "on the edge" design.







Layout Guidelines for Switching Power Supplies
When designing a high frequency switching regulated power supply, layout is very important. Using a good layout can solve many problems associated with these types of supplies. The problems due to a bad layout are often seen at high current levels and are usually more obvious at large input to output voltage differentials. Some of the main problems are loss of regulation at high output current and/or large input to output voltage differentials, excessive noise on the output and switch waveforms, and instability. Using the simple guidelines that follow will help minimize these problems.







PCB Layout Guidelines for Power Controllers
Power layouts require a few basic rules. This guideline for power controller layout addresses:
· The supply of sufficient current to the load.
· Noise immunity for the load and sense circuits.
· Accurate current sensing.
Reference the controller datasheet for helpful applications information such as component selection, set point calculations and thermal considerations.







Junction Temperature of TRF1123/TRF1223 and Recommended PCB Layout Guidelines
The reliability of a semiconductor is determined by the junction temperature, which in turn is dependent on several factors including device layout and mounting, package thermal resistance, PCB layout, heat sink interface, and ambient operating temperature. This application note describes PCB layout guidelines for the best thermal performance and reports on junction temperature measurements of the TRF1123 and the TRF1223.







Pentium® II Xeon™ Processor/Intel® 450NX PCIset AGTL+ Layout Guidelines
The Pentium® II Xeon™ processor is a follow-on to the Pentium Pro and Pentium II family of microprocessors and is the first 100 MHz Slot 2 processor. The design of the external Pentium II Xeon processor bus enables the Pentium II Xeon processor to be “multiprocessor ready.” To relax timing constraints on a bus that supports up to six loads, the Pentium II Xeon processor implements a synchronous, latched bus protocol that allows a full clock cycle for signal transmission and a full clock cycle for signal interpretation and generation.







PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages
Intersil’s Quad Flat No Lead (QFN) package is a relatively new packaging concept that is currently experiencing rapid growth. It offers a variety of benefits including reduced lead inductance, a small sized “near chip scale” footprint, thin profile, and low weight. It also uses perimeter I/O pads to ease PCB trace routing, and the exposed copper die-pad technology offers good thermal and electrical performance.







Minimum Size Copper Sense Resistors
The Micrel MIC5156/7/8 Super LDO™ Regulator Controllers require a moderately low-value current-sensing resistor. Building the resistor from printed-circuit board (PCB) copper is attractive; arbitrary values can be provided inexpensively. The ever-shrinking world of electronic assemblies requires minimizing the physical size of this resistor, which can present a power-dissipation issue that must be resolved to provide a reliable solution.







Thermal Design Considerations—EL75XX
Elantec's EL7560/EL7561/EL7556 series of voltage regulators are highly integrated, simple to use and the most effective switching mode designs to power microprocessors such as Intel Corporation's Pentium® Pro, and Pentium. The EL7560/EL7561 is designed for classes of processors such as the Pentium Pro. EL7556 is designed primarily for Pentium class desktop models.