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Lead Free and Tin-Lead Solder Joint Creation the Using Vapor Phase Reflow Process

By danro98 May 8th, 2009
Lead Free and Tin-Lead Solder Joint Creation the Using Vapor Phase Reflow Process

Standard test boards populated with common components including BGAs and QFPs were built with vapor phase and convection soldering technology and tested at Epic Technoligies, LLC facility.
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